Course syllabus for Introduction to microsystems packaging

The course syllabus contains changes
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Course syllabus adopted 2024-02-02 by Head of Programme (or corresponding).

Overview

  • Swedish nameGrunder till byggsätt för mikrosystem
  • CodeMKM106
  • Credits7.5 Credits
  • OwnerMPEES
  • Education cycleSecond-cycle
  • Main field of studyElectrical Engineering
  • DepartmentMICROTECHNOLOGY AND NANOSCIENCE
  • GradingTH - Pass with distinction (5), Pass with credit (4), Pass (3), Fail

Course round 1

  • Teaching language English
  • Application code 15120
  • Block schedule
  • Open for exchange studentsYes

Credit distribution

0124 Laboratory 2.5 c
Grading: UG		 2.5 c
0224 Examination 5 c
Grading: TH		 5 c
  • 17 Jan 2025 pm J
  • 15 Apr 2025 am J
  • 29 Aug 2025 pm J

In programmes

Examiner

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Eligibility

General entry requirements for Master's level (second cycle)
Applicants enrolled in a programme at Chalmers where the course is included in the study programme are exempted from fulfilling the requirements above.

Specific entry requirements

English 6 (or by other approved means with the equivalent proficiency level)
Applicants enrolled in a programme at Chalmers where the course is included in the study programme are exempted from fulfilling the requirements above.

Course specific prerequisites

You should have a B.Sc. or equivalent in engineering subjects that include basic physics and electrical engineering.

Aim

The aim of the course is to educate students in materials, processes, thermal management principles, and concepts for microsystems packaging. After the course, the students will be able to explain the driving forces behind the rapid development of microelectronic products. Students will be able to use packaging terminology to describe and address various challenges and application-specific requirements within this field. Students will also be able to master basic manufacturing, thermal management and packaging techniques at chip as well as at board level.

Learning outcomes (after completion of the course the student should be able to)

  • Describe microsystems packaging of fundamental technologies such as microelectronics, photonics and micro-electromechanical systems (MEMS) with relevant key concepts.
  • Select appropriate packaging technologies for different devices and applications.
  • Suggest solutions to well defined problems concerning packaging and component integration in:  
    • electrical package design for single-chip and multichip, 
    • IC assembly, 
    • wafer-level packaging, 
    • discrete, integrated and embedded passives, 
    • optoelectronics and MEMS, 
    • sealing, encapsulation and biocompatibility, 
    • Printed Wiring Board (PWB) technology and board assembly.
  • Assess and compare different manufacturing processes, packaging technologies and materials in order to make optimal choices based on specific requirements.
  • Discuss the challenges of packaging and thermal management in electronics in a meaningful way with a professional in the field.
  • Make basic design considerations for cooling of microelectronics.
  • Discuss the reasons for reliability differences in packages and packaging technologies.
  • Use simple characterization methods to determine thermal, mechanical and electrical properties as well as the reliability of packaging materials and electronics systems.
  • Choose the right reliability tests and characterization methods for components and interconnects in a packaged system.

Content

A number of lectures will be provided to give a background on microsystems packaging and production. Invited guests from the electronics industry will talk about the importance of the microelectronics industry, the complexity of microelectronic products and the specific problems related to them. In addition to this, exercises and laboratory work will enhance the students understanding of the basic concepts in microelectronics, microsystems packaging and production. The lectures and exercises will cover the following topics: 
  • Introduction to microsystems packaging and production, 
  • components types, 
  • IC assembly and wafer level packaging,
  • passives,
  • packaging and techniques, 
  • MEMS packaging, 
  • sealing and encapsulation, 
  • System-level PWB technology and board assembly, 
  • packaging materials and processes.

Organisation

The organization of the course is the following:
  1. Lectures
  2. Tutorials
  3. Compulsory home assignments
  4. Compulsory laboratory work: Lab A: Surface mount technology, Lab B: Flip chip assembly technology, Lab C: Characterization of thermal conductivity
  5. Compulsory written hand-ins after laboratory work 
  6. Compulsory guest lectures
  7. Study visit to a company

Literature

Rao Tummala: Device and Systems Packaging: Technologies and Applications, Second Edition, McGraw Hill Education, New York, USA, 2019, ISBN: 978-1259861550

Examination including compulsory elements

  • Written examination with scale: not passed, 3, 4 and 5.
  • Home assignments with scale: not passed, 3, 4 and 5.
  • Laboratory work passed.
  • Approved written hand-ins after laboratory work.
  • Attendance at guest lectures.
  • Final grade is based on the written exam (90%) and home assignments (10%).

The course examiner may assess individual students in other ways than what is stated above if there are special reasons for doing so, for example if a student has a decision from Chalmers on educational support due to disability.

The course syllabus contains changes

  • Changes to course rounds:
    • 2024-03-14: Block Block B+ added by Examinator
      [Course round 1]